Factory Lead Time  

12 Weeks

Package / Case  

668-BBGA Exposed Pad

Surface Mount  

YES

Operating Temperature  

0°C~105°C TA

Packaging  

Tray

Series  

MPC83xx

Published  

2002

JESD-609 Code  

e2

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

668

ECCN Code  

3A991.A.2

Terminal Finish  

TIN COPPER/TIN SILVER

HTS Code  

8542.31.00.01

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Supply Voltage  

1.2V

Terminal Pitch  

1mm

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

MPC8358

JESD-30 Code  

S-PBGA-B668

Speed  

266MHz

uPs/uCs/Peripheral ICs Type  

MICROPROCESSOR, RISC

Core Processor  

PowerPC e300

Clock Frequency  

66.67MHz

Bit Size  

32

Address Bus Width  

32

Boundary Scan  

YES

Low Power Mode  

YES

External Data Bus Width  

32

Format  

FLOATING POINT

Integrated Cache  

YES

Voltage - I/O  

1.8V 2.5V 3.3V

Ethernet  

10/100/1000Mbps (1)

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

No

RAM Controllers  

DDR, DDR2

USB  

USB 1.x (1)

Additional Interfaces  

DUART, HDLC, I2C, PCI, SPI, UART

Co-Processors/DSP  

Communications; QUICC Engine

Voltage - Supply (Max)  

1.26V

Voltage - Supply (Min)  

1.14V

Length  

29mm

Height Seated (Max)  

2.46mm

RoHS Status  

ROHS3 Compliant